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1 sheet no.: d1-a01701en date: november 30, 2007 ?sharp corporation PT100MC0MPx PT100MC0MPx surface mount type, transparent resin phototransistor notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the la test device specification sheets before usin g any sharp device. features 1. compact and thin smd package 2. top view and side view mountable 3. plastic mold with transparent resin lens 4. peak sensitivity wavelength: 900 nm typ. 5. narrow directivity angle ( ? : 15 typ.) 6. lead free and rohs directive compliant model line-up agency approvals/compliance 1. compliant with rohs directive (2002/95/ec) 2. content information about the six substances specified in ?management methods for control of pollution caused by electronic information prod- ucts regulation? (popular name: china rohs) (chinese: ); refer to page 7. applications 1. office automation equipment 2. audio visual equipment 3. home appliances 4. telecommunication equipment 5. measuring equipment 6. tooling machines/factory automation 7. touch panels model no. packaging mount direction PT100MC0MP 2000 pcs/reel side view PT100MC0MP1 1500 pcs/reel top view
sheet no.: d1-a01701en 2 PT100MC0MPx external dimensions (center of lens) viewed from pcb (side view mounting) viewed from pcb (top view mounting) collector terminal connection notes: 1. unit: mm 2. unspecified tolerance: 0.2 mm 3. ( ): reference dimensions 4. au plated area 5. do not allow circuit runs in area 3.0 2.8 0.75 (0.35) 0.65 (0.4) 1.5 2.2 (1.0) (1.0) 2.2 1.0 0.4 (0.2) 0.95 1.5 (0.65) (0.57) (0.57) 3.0 3.0 r0.8 1.4 1.7 0.85 1.1 1.1 1.1 1.5 1.1 1.5 1 2 1 2 1 2 emitter no. pin arrangement name 2
sheet no.: d1-a01701en 3 PT100MC0MPx absolute maximum ratings * 1 within 10 s (max.) see reflow profile in fig. 10. electro-optical charactertistics * 1 ee: irradiance by cie standard light source a (tungsten lamp) parameter symbol rating unit collector-emitter voltage v ceo 35 v emitter-collector voltage v eco 6v collector current i c 20 ma collector power dissipation p c 75 mw operating temperature topr -30 to +85 c storage temperature tstg -40 to +95 c soldering temperature *1 tsol 240 c parameter symbol conditi ons *1 min. typ. max. unit collector current i c ee = 1 mw/cm 2 , v ce = 5 v 1.7 2.9 5.1 ma collector dark current i ceo ee = 0, v ce = 20 v ? 1.0 100 na collector-emitter saturation voltage v ce (sat) ee = 10 mw/cm 2 , i c = 0.5 ma ? 0.1 0.4 v collector-emitter breakdown voltage bv ceo i c = 0.1 ma, ee = 0 35 ? ? v emitter-collector breakdown voltage bv eco i e = 0.01 ma, ee = 0 6 ? ? v peak sensitivity wavelength p??900?nm response time (rise) tr v ce = 2 v, i c = 2 ma, r l = 100 ?5.0? s response time (fall) tf ? 6.0 ? s angle of half intensity ? ? ? 15 ? degrees fig. 1 collector po wer dissipation vs. ambient temperature collector po w er dissipation p c (m w ) 0 10 20 15 30 40 50 60 70 75 8 0 -30 0 25 50 8 5 75 100 am b ient temperat u re ta (c) fig. 2 collector dark current vs. ambient temperature collector dark c u rrent i ceo (a) 10 -10 10 -9 10 - 8 10 -7 10 -6 02550 8 5 75 100 am b ient temperat u re ta (c) v ce = 20 v (ta = 25c) (ta = 25c)
sheet no.: d1-a01701en 4 PT100MC0MPx fig. 3 relative coll ector current vs. ambient temperature fig. 4 collector cu rrent vs. irradiance -50 -25 -30 v ce = 5 v e e = 1m w /cm 2 0 20 40 60 8 0 100 120 140 160 100 0255075 8 5 relati v e collector c u rrent (%) am b ient temperat u re ta (c) irradiance ee (m w /cm 2 ) collector c u rrent i c (ma) 0.1 1 10 0.01 100 10 1 0.1 v ce = 5 v ta = 25c fig. 5 collector current vs. collector-emitter voltage fig. 6 relative sensitivity vs. wavelength (typ.) collector c u rrent i c (ma) 0 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 4 035 30 25 20 15 10 5 collector-emitter v oltage v ce ( v ) e e = 1 m w /cm 2 p c (max) ta = 25c 0.75 m w /cm 2 0.5 m w /cm 2 0.25 m w /cm 2 0.1 m w /cm 2 relati v e sensiti v ity (%) 0 20 40 60 8 0 100 w a v elength (nm) 400 500 600 700 8 00 900 1000 1100 1200
sheet no.: d1-a01701en 5 PT100MC0MPx fig. 7 radiation diagram (typ.) fig. 8 collector-emitter saturation voltage vs. irradiance 0 -10 +10 +20 0 -20 -30 -40 -50 -60 -70 - 8 0 -90 +30 +40 +50 +60 +70 + 8 0 +90 ang u lar displacement relati v e sensiti v ity (%) 100 8 0 60 40 20 ta = 25c collector-emitter sat u ration v oltage v ce (sat) ( v ) irradiance e e (m w /cm 2 ) 0 1.4 1.2 1.0 0. 8 0.6 0.4 0.2 0.01 0.1 1 10 ta = 25c i c = 0.1 ma 0.5 ma 2 ma 1 ma fig. 9 relative output vs. distance to detector relati v e o u tp u t (%) 0.01 0.1 1 10 100 0.1 1 10 100 1000 distance to detector (mm) i f = constant ta = 25c (emitter: gl100m n 0mp)
sheet no.: d1-a01701en 6 PT100MC0MPx design considerations design guidelines 1. this product is not designed to be electroma gnetic- and ionized-particle-radiation resistant. manufacturing guidelines soldering instructions 1. sharp recommends soldering no more than once when using solder reflow methods. 2. when using solder reflow methods, follow the reflow soldering temperature profile shown in fig. 10. sharp rec- ommends checking the process to make sure these parameters are not exceeded; exceeding these parameters can cause substrate bending or other mechanical stresse s leading to debonding of the internal gold wires, or other similar failure modes. 3. if using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the part's resin. be sure to keep the temperature profile within the guidelines shown in fig. 10. 4. if hand soldering, use temperatures 240 for 3 seconds. do not dip-sold er or vps-solder this part. 5. do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. internal connections may be severed due to mechanical force placed on the pack- age due to the pcb flexing during the soldering process. cleaning instructions 1. confirm this device's resistance to process chemicals be fore use, as certain process chemicals may affect the optical characteristics. 2. solvent cleaning: solvent temperature should be 45c or below. immersion time should be 3 minutes or less. 3. ultrasonic cleaning: the effect upon devices varies d ue to cleaning bath size, ultrasonic power output, cleaning time, pcb size and device mounting circumstances. sharp recommends testing using actual production condi- tions to confirm the harmlessness of the ultrasonic cleaning methods. 4. recommended solvent materials: ethyl alcohol, methyl alcohol, and isopropyl alcohol. fig. 10 reflow solderi ng temperature profile 200c 25c 240c max. 120s max. 90s max. 60s max. 10s max. 165c max. 1 to 4 c/s 1 to 4 c/s 1 to 4c/s
sheet no.: d1-a01701en 7 PT100MC0MPx storage and handling 1. store these parts between 5c and 30c, at a relative humidity of less than 70 % . 2. after breaking the package seal, maintain the environment within 5c to 25c, at a relative humidity of less than 60 % , and mount the parts within two days. if unable to do so, bake before mounting. 3. when storing the parts after breaking the seal, sharp recommends storage of no longer than two weeks in a dry box or by resealing the parts in a moisture-proof bag with a desiccant. if unable to do so, bake before mounting. 4. when baking the parts before mounting, sharp recommends baking the parts only once and only if in a metal tray or mounted on a pcb. recommended conditions are for 16 to 24 hours, at a temperature of 125c. presence of odcs (rohs compliance) this product shall not contain the following materials, and they are not used in the production process for this product: ? regulated substances: cfcs, halon, carbon tetrachlor ide, 1,1,1-trichloroethane (methylchloroform). specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ? lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated diphenyl ethers (pbde). ? content information about the six substances specified in ?management methods for control of pollution caused by electronic informatio n products regulation? (chinese: ) note: ? indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the conc entration limit requirement as described in sj/t 11363-2006 standard. taping specifications 1. tape structure and dimensions conforms to those shown in fig. 11 to 16. 2. product insertion will have the collect or to the hole side of the tape. 3. cover tape peel-separation force: f = 0.2 to 1.0 n (where 160 to 180) 4. quantity per reel = 2000 pcs. (PT100MC0MP) or 1500 pcs. (PT100MC0MP1) 5. product mass: 0.01 g (approx.) 6. packaging: a. reels are sealed inside an aluminum bag, along with a humidity indicator card. b. bags are labeled and securely packed. category toxic and hazdardous substances lead (pb) mercury (hg) cadmium (cd) hexavalent chromiun (cr 6+ ) polybrominated biphenyls (pbb) polybrominated diphenyl ethers (pbde) photo transistor ??????
sheet no.: d1-a01701en 8 PT100MC0MPx packing specifications PT100MC0MPx (side view mount, 2000 pcs/reel) fig. 11 tape shape and dimension fig. 12 reel shape and dimension 4.0 0.1 2.0 0.05 4.0 0.1 1.6 0.1 2.5 0.1 1.75 0.1 0.3 0.05 5.5 0.1 5 3.5 0.05 8 .0 0.3 1.75 0.1 1.5 +0.1 -0 3.3 0.1 1.7 0.1 1 8 0.0 note: unit: mm 11.4 1 2.0 0.5 13.0 0.2 9.0 +0.3 -0 60.0 +1 -0
sheet no.: d1-a01701en 9 PT100MC0MPx PT100MC0MP1 (top view mount, 1500 pcs/reel) fig. 13 product insertion direction fig. 14 tape shape and dimension p u ll-o u t direction 4.0 0.1 2.0 0.05 4.0 0.1 1. 8 0.1 2.45 0.1 0.3 0.05 5.5 0.1 5 3.5 0.05 8 .0 0.3 1.75 0.1 3.3 0.1 1.5 +0.1 -0
sheet no.: d1-a01701en 10 PT100MC0MPx fig. 15 reel shape and dimension fig. 16 product insertion direction 1 8 0.0 note: unit: mm 11.4 1 2.0 0.5 13.0 0.2 9.0 +0.3 -0 60.0 +1 -0 p u ll-o u t direction
important notices the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp?s devices. contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristi cs, data materials, struc- ture, and other contents described herein at any time without notice in order to im prove design or reliability. manufacturing locations are also subject to change without notice. observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment (terminal) --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to en sure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliabilty such as: --- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high level of reliability an d safety such as: --- space applications --- telecommunication equipment (trunk lines) --- nuclear power control equipment --- medical and other life support equipment (e.g. scuba) if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. sheet no.: d1-a01701en 11 PT100MC0MPx

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